Heat Sinks

Intel® Skylake-Based Thermal Solutions

Intel Skylake microarchitecture, the successor to the Boradwell microarchitecture, is built on 14nm manufacturing process with higher power efficiency and compute performance. To ensure the CPU performance and achieve the nominal power consumption, Delta has designed a series of Intel Skylake-based heatsinks optimized cooling performance and minimal thermal resistance for server and data center environment.

Delta Heatsinks for Intel® Skylake-Based Server Platforms

Delta offers a various of heatsink solutions including extruded, heat pipe, and vapor chamber to meet the most demanding thermal challenges.

Product	Heat transfer technology	Air flow	Thermal resistance
1U Heatsink - Entry-Level	Aluminum-extruded	15 CFM	TBD
1U Heatsink - Mid-Level	Heatpipe, aluminum-based	15 CFM	0.215 ºC/W
1U Heatsink - Mid-Level	Heatpipe, copper-based	15 CFM	0.195 ºC/W
1U Heatsink - Advanced	Vapor chamber	15 CFM	0.192 ºC/W
1.5U Heatsink	Heatpipe, aluminum-based	21.1 CFM	0.192 ºC/W
2U Heatsink - Entry-Level	Aluminum-extruded	21.5 CFM	0.224 ºC/W
2U Heatsink - Mid-Level	Heatpipe, aluminum-based	21.5 CFM	0.167 ºC/W
4U Heatsink - Entry-level	Aluminum-extruded	23.2 CFM	0.306 ºC/W
4U Heatsink - Mid-level	Heatpipe, aluminum-based	23.2 CFM	0.186 ºC/W
5U Heatsink	Heatpipe, aluminum-based	23.2 CFM	0.138 ºC/W

*The performance data is subject to change.

Ultra slim heat pipe

For slim Heat Pipe with sintering powder wick structure, minimum diameter of 5mm flatten to 0.6 mm could be manufactured. And by fiber and mesh wick structure, it can reach to 0.4 mm by flatten diameter of 2mm. Delta is capability of designing and suggesting suitable wick structure for different application.

General design guidelines: (bendable, thin, and customized shapes)

Diameter (mm)	Thickness (mm)	Length (mm)	Heat Capacity
2	0.35~1.0	50~200	3~5
3	0.40~1.0	50~200	4~7
4	0.5~1.0	50~200	5~8
5	0.6~1.0	50~200	6~15
6	0.6~1.0	50~300	6~30
7	0.8~1.3	80~350	10~30
8	0.8~1.3	80~350	15~40
10	1~1.3	80~350	20~60

*The performance data is subject to change.

Ultra slim vapor chamber

For slim vapor chamber, Delta can apply the maximum dimension of 200mm x 200mm, and the minimum thickness of 0.35mm. The VC surface flatness could be controlled within 0.2/100x100 mm2 by diffusion bonding. The surface ΔT should be controlled within 3 ºC. (Thermal conductivity: k ~ 6000 W/ ºC-m ).

General design guidelines: (thin and customized shapes)